发明名称 BIO CHIP PACKAGE BODY, METHOD OF FORMING THE BIO CHIP PACKAGE BODY AND BIO CHIP PACKAGE COMPRISING THE BIO CHIP PACKAGE BODY
摘要 <p>PURPOSE: A bio chip package body, a method for forming the same, and a bio chip package including the same are provided to control a flow of an adhesive outputted between receiving and covering package bodies. CONSTITUTION: A bio chip package body(100) includes a receiving package body(90). The receiving package body includes at least one protrusion part(P) and an extending part(E2). The protrusion is formed on a receiving plate(84). The extension part is extended from the lower side of the protrusion. The protrusion includes a chip receiver(C1) and a chip protector(C2). The chip receiver is positioned in the center of the protrusion. The chip protector is positioned around the protrusion.</p>
申请公布号 KR20100031891(A) 申请公布日期 2010.03.25
申请号 KR20080090750 申请日期 2008.09.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SIM, TAE SEOK;LEE, DONG HO
分类号 H01L23/28 主分类号 H01L23/28
代理机构 代理人
主权项
地址