发明名称 |
BIO CHIP PACKAGE BODY, METHOD OF FORMING THE BIO CHIP PACKAGE BODY AND BIO CHIP PACKAGE COMPRISING THE BIO CHIP PACKAGE BODY |
摘要 |
<p>PURPOSE: A bio chip package body, a method for forming the same, and a bio chip package including the same are provided to control a flow of an adhesive outputted between receiving and covering package bodies. CONSTITUTION: A bio chip package body(100) includes a receiving package body(90). The receiving package body includes at least one protrusion part(P) and an extending part(E2). The protrusion is formed on a receiving plate(84). The extension part is extended from the lower side of the protrusion. The protrusion includes a chip receiver(C1) and a chip protector(C2). The chip receiver is positioned in the center of the protrusion. The chip protector is positioned around the protrusion.</p> |
申请公布号 |
KR20100031891(A) |
申请公布日期 |
2010.03.25 |
申请号 |
KR20080090750 |
申请日期 |
2008.09.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SIM, TAE SEOK;LEE, DONG HO |
分类号 |
H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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