发明名称 Multiple die structure and method of forming a connection between first and second dies in same
摘要 A multiple die structure includes a first die (110), a second die (120), a carbon nanotube (130) having a first end (131) in physical contact with the first die and having a second end (132) in physical contact with the second die, and an electrically conductive material (240) in physical contact with the first end of the carbon nanotube and in physical contact with the first die. Forming a connection between the first die and the second die can include providing a connection structure (400, 500, 600, 900) in which the electrically conductive material is adjacent to the carbon nanotube, placing the connection structure adjacent to the first die and to the second die, and bonding the first die and the second die to the connection structure.
申请公布号 US2010072617(A1) 申请公布日期 2010.03.25
申请号 US20080284531 申请日期 2008.09.22
申请人 SUPRIYA LAKSHMI;CAMACHO-BRAGADO GLORIA ALEJANDRA 发明人 SUPRIYA LAKSHMI;CAMACHO-BRAGADO GLORIA ALEJANDRA
分类号 H01L21/60;H01L23/498 主分类号 H01L21/60
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