| 摘要 |
The multiprocessor system includes first and second multiport semiconductor memory devices, first, second and third processors individually storing a first boot loader, the first and second processors being configured to access the first multiport semiconductor memory device, and the second and third processors being configured to access the second multiport semiconductor memory device, and a memory link architecture including the second multiport semiconductor memory device, the third processor, and a nonvolatile semiconductor memory device. The nonvolatile semiconductor memory device includes a plurality of storage areas storing a second boot loader and software for the first, second and third processors. The third processor is configured to access the nonvolatile semiconductor memory device and configured to apply the second boot loader to the first and second processors through a serial communication to perform a portion of booting the system.
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