发明名称 FILM FORMATION METHOD AND FILM FORMATION APPARATUS
摘要 A film formation method is disclosed for depositing a metal film on a target substrate by supplying a metal carbonyl source in gas phase to a surface of the target substrate and decomposing the source near the surface of the target substrate. The method includes a step of preferentially decomposing the metal carbonyl source in an area near the outer peripheral portion of the target substrate when the metal film is being deposited on the surface of the target substrate. As a result, a CO concentration in the atmosphere is increased locally near the outer peripheral portion of the target substrate and the depositing of the metal film on the outer peripheral portion is better controlled.
申请公布号 US2010075035(A1) 申请公布日期 2010.03.25
申请号 US20080443487 申请日期 2008.02.19
申请人 TOKYO ELECTRON LIMITED, 发明人 GOMI ATSUSHI;MIZUSAWA YASUSHI;HATANO TATSUO;HARA MASAMICHI;YOKOYAMA OSAMU;TAGA SATOSHI
分类号 C23C16/16;C23C16/00 主分类号 C23C16/16
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