发明名称 |
PLANAR ENCAPSULATION AND MOLD CAVITY PACKAGE IN PACKAGE SYSTEM |
摘要 |
An integrated circuit package system includes: providing a substrate; mounting a first package above the substrate, the first package having a mold cavity exposing an exposed portion on a first integrated circuit from a first package encapsulation; mounting a second package above the first package and attached to the exposed portion of the first integrated circuit; mounting a structure above the second package and connected to the substrate around the first package; and encapsulating the first package and the second package with an outer encapsulation having a completely planar top or a planar top co-planar to a top surface of the structure.
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申请公布号 |
US2010072634(A1) |
申请公布日期 |
2010.03.25 |
申请号 |
US20080236445 |
申请日期 |
2008.09.23 |
申请人 |
HA JONG-WOO;PAGAILA REZA ARGENTY |
发明人 |
HA JONG-WOO;PAGAILA REZA ARGENTY |
分类号 |
H01L23/28;H01L21/00 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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