发明名称 APPARATUS AND METHOD FOR DROPLET APPLICATION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a droplet application apparatus capable of suppressing the occurrence of a part left without application and performing the application of excellent quality. <P>SOLUTION: The droplet application apparatus includes a housing chamber 11 for housing an application object K having an application surface Ka, a solvent supply part 13 for supplying solvent vapor into the housing chamber 11, and an application head for discharging droplets toward the application surface Ka where a solvent is dew-condensed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010066477(A) 申请公布日期 2010.03.25
申请号 JP20080232239 申请日期 2008.09.10
申请人 SHIBAURA MECHATRONICS CORP 发明人 IKUTA AKIRA
分类号 G02B5/20;B05C5/00;B05C9/10;B05D1/26;B05D3/10 主分类号 G02B5/20
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