| 摘要 |
<P>PROBLEM TO BE SOLVED: To automatically and reliably clean a die. Ž<P>SOLUTION: The resin sealing device 100 includes: a frame supply part 110 for housing a frame for production therein; a resin supply part 116 for supplying a resin for production for resin-sealing the frame for production; and a die 118 for carrying out resin sealing with the frame for production and the resin for production arranged therein. The frame supply part 110 includes a dedicated magazine 110Z for housing a dummy frame used for cleaning the die 118; and a resin for cleaning, used for cleaning the die 118, is arranged in the resin supply part 116 at a position 116Z different from that of the resin for production. The resin sealing device includes a device control part 140 controlling to execute resin sealing by changing over the frame for production and the resin for production to the dummy frame and the resin for cleaning, respectively, by a preset number of times of resin sealing. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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