| 摘要 |
<p>Provided is a device wherein a plurality of electronic components are mounted in layers. In the device, electronic components are protected from heat generated from an electronic component having a high heating value. A device (1) wherein electronic components are mounted is provided with a first electronic component (2), which has an external terminal (not shown in the figure) on a first surface (2a), and a heat spreader (6) on a second surface (2b); at least one second electronic component (4b) arranged in the direction of the second surface (2b) of the first electronic component (2); a flexible circuit board (3), which is electrically connected with the first electronic component (2) and at least one second electronic component (4b), and has at least a portion, to which at least one second electronic component (4b) is connected, partially arranged on the side of the second surface (2b) of the first electronic component (2); and a spacer (5), which is arranged between at least a part of the flexible circuit board (3) and the second surface (2b) of the first electronic component (2). The spacer (5) prevents heat generated by the first electronic component (2) from being directly transferred to the second electronic component (4b).</p> |
