THERMOCOMPRESSION BONDING DEVICE AND PACKAGING METHOD OF ELECTRICAL COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a packaging technique using an adhesive which can prevent connection defect or deterioration in connection reliability due to warpage of a packaging part of an electrical component.

SOLUTION: The thermocompression bonding device has a stage 2 with a support pressing surface 21 which supports and presses a thermocompression object, and a thermocompression head 3 having a pressing surface 31 which presses the thermocompression object. The thermocompression device presses and heats the thermocompression object while holding the thermocompression object between the support pressing surface 21 of the stage 2 and the pressing surface 31 of the thermocompression head 3. Each of the support pressing surface 21 of the stage 2 and the pressing surface 31 of the thermocompression head 3 is formed in the corresponding curved shapes.

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