| 发明名称 |
METHOD AND DEVICE FOR PROCESSING BRITTLE SUBSTRATE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem in which a fine cullet is generated in a breaking process carried out at the last step in a laser beam machine. <P>SOLUTION: A brittle substrate is completely broken without applying mechanical external stress to the brittle substrate, by further radiating laser after carrying out a usual processing by laser radiation and coolant spraying. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2010064493(A) |
申请公布日期 |
2010.03.25 |
| 申请号 |
JP20090278260 |
申请日期 |
2009.12.08 |
| 申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
ITO AKIRA;UENO TSUTOMU;FUJII MASAHIRO |
| 分类号 |
B28D5/00;B23K26/067;B23K26/08;B23K26/38;B23K26/40;B23K26/42;C03B33/03;C03B33/09;H01L21/301 |
主分类号 |
B28D5/00 |
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