| 摘要 |
The present invention relates to a microchip, a die for forming the microchip, and an electroforming master for the die. A microchip is formed of a resin material and includes: a resin material; and a surface on which a channel groove with a width and depth both in a range of 1 to 1000 μm is formed. A bottom surface of the channel groove includes a projecting-and-depressed section with a height of 5% or lower of the depth of the channel groove.
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