发明名称 CONDUCTIVE FILLER, CONDUCTIVE PASTE AND ARTICLE HAVING CONDUCTIVE FILM
摘要 <p>Disclosed are a conductive filler which has excellent oxidation resistance and can be sintered easily, a conductive paste which has excellent storage stability in the air and is capable of forming a conductive film with high conductivity, and an article having conductive film with high conductivity. The conductive filler is characterized by containing a copper filler having an average aggregate particle diameter of 0.5-20 µm, copper nanoparticles having an average aggregate particle diameter of 50-200 nm and an aliphatic carboxylic acid.  The conductive filler is also characterized in that the copper nanoparticles are contained in an amount of 5-50 parts by mass per 100 parts by mass of the copper filler, and the aliphatic carboxylic acid is contained in an amount of 1-15 parts by mass per 100 parts by mass of the total of the copper filler and the copper nanoparticles.</p>
申请公布号 WO2010032841(A1) 申请公布日期 2010.03.25
申请号 WO2009JP66420 申请日期 2009.09.18
申请人 ASAHI GLASS COMPANY, LIMITED;NAKANISHI, KEI;HIRAKOSO, HIDEYUKI;KOBAYASHI, KAZUSHI;ABE, KEISUKE 发明人 NAKANISHI, KEI;HIRAKOSO, HIDEYUKI;KOBAYASHI, KAZUSHI;ABE, KEISUKE
分类号 H01B5/00;B22F1/00;B22F9/30;H01B1/22;H01B5/14 主分类号 H01B5/00
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