发明名称 |
CONDUCTIVE FILLER, CONDUCTIVE PASTE AND ARTICLE HAVING CONDUCTIVE FILM |
摘要 |
<p>Disclosed are a conductive filler which has excellent oxidation resistance and can be sintered easily, a conductive paste which has excellent storage stability in the air and is capable of forming a conductive film with high conductivity, and an article having conductive film with high conductivity. The conductive filler is characterized by containing a copper filler having an average aggregate particle diameter of 0.5-20 µm, copper nanoparticles having an average aggregate particle diameter of 50-200 nm and an aliphatic carboxylic acid. The conductive filler is also characterized in that the copper nanoparticles are contained in an amount of 5-50 parts by mass per 100 parts by mass of the copper filler, and the aliphatic carboxylic acid is contained in an amount of 1-15 parts by mass per 100 parts by mass of the total of the copper filler and the copper nanoparticles.</p> |
申请公布号 |
WO2010032841(A1) |
申请公布日期 |
2010.03.25 |
申请号 |
WO2009JP66420 |
申请日期 |
2009.09.18 |
申请人 |
ASAHI GLASS COMPANY, LIMITED;NAKANISHI, KEI;HIRAKOSO, HIDEYUKI;KOBAYASHI, KAZUSHI;ABE, KEISUKE |
发明人 |
NAKANISHI, KEI;HIRAKOSO, HIDEYUKI;KOBAYASHI, KAZUSHI;ABE, KEISUKE |
分类号 |
H01B5/00;B22F1/00;B22F9/30;H01B1/22;H01B5/14 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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