| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component built-in wiring board composed by filling a part between an electronic component and a wiring pattern with an insulating member without forming a gap, improving the adhesion of the electronic component and the wiring board, and preventing the peeling of the electronic component from the wiring pattern. <P>SOLUTION: An electronic component laminate composed by connecting the electronic component through a connecting member on a first metallic film formed on a first support and a prepreg laminate composed by forming a bump and a prepreg for making the bump pass through on a second metallic film formed on a second support are laminated so as to vertically invert the prepreg laminate, and the electronic component laminate and the prepreg laminate are heated and pressurized from the vertical direction through the first support and the second support. Then, the first metallic film and the second metallic film are patterned to form the wiring pattern of two layers facing each other, and the electronic component built-in type two-layer wiring board is obtained. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
