发明名称 METHOD OF PRINTING WIRING BY USING INKJET APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of printing circuit wiring on a board by using an inkjet apparatus. Ž<P>SOLUTION: The wiring printing method includes steps of: forming an original bitmap image including information of circuit wiring to be printed on a board; primarily printing the circuit wiring according to the original bitmap image on the board by using the inkjet apparatus; forming a primary printed image by photographing the circuit wiring primarily printed on the board; forming a complementary bitmap image including complementary printing information corresponding to a defectively printed portion based on the primary printed image; and secondarily printing a portion relevant to the complementary bitmap image on the board by using the inkjet apparatus. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010067981(A) 申请公布日期 2010.03.25
申请号 JP20090208419 申请日期 2009.09.09
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK JAE-CHAN;JOUNG JAE-WOO;LEE RO-WOON;KIM YONG-SIK
分类号 H05K3/10;H05K3/22 主分类号 H05K3/10
代理机构 代理人
主权项
地址