发明名称 |
METHOD OF PRINTING WIRING BY USING INKJET APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of printing circuit wiring on a board by using an inkjet apparatus. Ž<P>SOLUTION: The wiring printing method includes steps of: forming an original bitmap image including information of circuit wiring to be printed on a board; primarily printing the circuit wiring according to the original bitmap image on the board by using the inkjet apparatus; forming a primary printed image by photographing the circuit wiring primarily printed on the board; forming a complementary bitmap image including complementary printing information corresponding to a defectively printed portion based on the primary printed image; and secondarily printing a portion relevant to the complementary bitmap image on the board by using the inkjet apparatus. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010067981(A) |
申请公布日期 |
2010.03.25 |
申请号 |
JP20090208419 |
申请日期 |
2009.09.09 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
PARK JAE-CHAN;JOUNG JAE-WOO;LEE RO-WOON;KIM YONG-SIK |
分类号 |
H05K3/10;H05K3/22 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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