发明名称
摘要 A method for forming semiconductor devices is provided. A gate stack is formed over a surface of a substrate. A plurality of cycles for forming polymer spacers on sides of the gate stack is provided, where each cycle comprises providing a deposition phase that deposits material on the sides of the polymer spacer and over the surface of the substrate, and providing a cleaning phase that removes polymer over the surface of the substrate and shapes a profile of the deposited material. Dopant is implanted into the substrate using the polymer spacers as a dopant mask. The polymer spacers are removed.
申请公布号 JP2010509776(A) 申请公布日期 2010.03.25
申请号 JP20090536381 申请日期 2007.10.26
申请人 发明人
分类号 H01L21/336;H01L21/3065;H01L21/318;H01L21/8238;H01L27/092;H01L29/78 主分类号 H01L21/336
代理机构 代理人
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