发明名称 |
MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE |
摘要 |
Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A first outer layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A capacitor is used to capacitively couple the plating stub to a ground layer.
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申请公布号 |
US2010073893(A1) |
申请公布日期 |
2010.03.25 |
申请号 |
US20080237444 |
申请日期 |
2008.09.25 |
申请人 |
INTERNATIONAL BUSINESS MECHINES CORPORATION |
发明人 |
MUTNURY BHYRAV MURTHY;CASES MOISES;NA NANJU;KIM TAE HONG |
分类号 |
H05K7/00;H01L21/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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