发明名称 LIGHT EMITTING DIODE ILLUMINATION ASSEMBLY
摘要 A light emitting diode (LED) illumination assembly comprises a base, at least one first LED chip and at least one light modulation subassembly. The base is formed with a receiving groove, in which at least one first arrangement region and at least one second arrangement region recessed from the first arrangement region are located. The first LED chip is mounted on the first arrangement region for projecting at least one first light beam. The light modulation subassembly comprises a second LED chip and a light-transmissible layer. The second LED chip is mounted on the second arrangement region for projecting a second light beam. The light-transmissible layer contains phosphor powder, and covers the second LED chip. The second light beam is stimulated after transmitting through the light-transmissible layer, and mixes with the first light beam after being stimulated, so as to generate an illumination light beam.
申请公布号 US2010072891(A1) 申请公布日期 2010.03.25
申请号 US20080235841 申请日期 2008.09.23
申请人 EDISON OPTO CORPORATION 发明人 LIAO HUNG-TA;CHOU HONG-SYUN
分类号 H01J1/62 主分类号 H01J1/62
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