发明名称 PRINTED WIRING BOARD AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board having a land capable of obtaining a wide packaging area. SOLUTION: The printed wiring board includes: a substrate body 33, having a side 35 for prescribing one portion of the outer periphery and a fixing hole 36 through which a screw 26 is passed while the fixing hole 36 is provided at a position adjacent to the side 35; and a land 34 that is provided near the fixing hole 36, and is spread toward the periphery from the fixing hole 36 in a range between a direction D1 toward a center 45 of the substrate body 33 from the fixing hole 36 and a direction D2 along an extension direction of the side 35. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010067776(A) 申请公布日期 2010.03.25
申请号 JP20080232390 申请日期 2008.09.10
申请人 TOSHIBA CORP 发明人 HASEGAWA KENJI;KOZAI TAKESHI;KANO TERUSHIGE
分类号 H05K1/11;H05K1/02 主分类号 H05K1/11
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