发明名称 MULTI SOCKET GUIDE AND TEST DEVICE COMPRISING THE SAME
摘要 PURPOSE: A multi-socket guide and a tester comprising the same are provided to guide various size of semiconductor package to the tester. CONSTITUTION: A fixing part(160) is placed at a housing and fixes a guide at a tester. A mounting part(140) has semiconductor package. The size of the mounting part do not relates to the size of the semiconductor package. The size of the mounting part corresponds to a ball size.
申请公布号 KR20100032210(A) 申请公布日期 2010.03.25
申请号 KR20080091256 申请日期 2008.09.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JIN, HONG JUN;KIM, JONG MI;SONG, YOON GYU
分类号 H01R33/76;G01R31/26 主分类号 H01R33/76
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