发明名称 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board that can form a minute and precise circuit pattern through inkjet printing and improve adhesion between the circuit pattern and an insulation layer. <P>SOLUTION: The method of manufacturing a printed circuit board includes: a process of forming a circuit pattern by discharging conductive ink on a carrier through inkjet printing; a process of heating and sintering the circuit pattern; and a process of transferring the circuit pattern by stacking the carrier on an insulation layer such that the circuit pattern is buried in the insulation layer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010067946(A) 申请公布日期 2010.03.25
申请号 JP20090112212 申请日期 2009.05.01
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 REMIZOV SERGEY;JOUNG JAE-WOO;JUNG HYUN-CHUL;SONG YOUNG-AH
分类号 H05K3/10;H05K3/12;H05K3/20 主分类号 H05K3/10
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