发明名称 |
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board that can form a minute and precise circuit pattern through inkjet printing and improve adhesion between the circuit pattern and an insulation layer. <P>SOLUTION: The method of manufacturing a printed circuit board includes: a process of forming a circuit pattern by discharging conductive ink on a carrier through inkjet printing; a process of heating and sintering the circuit pattern; and a process of transferring the circuit pattern by stacking the carrier on an insulation layer such that the circuit pattern is buried in the insulation layer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010067946(A) |
申请公布日期 |
2010.03.25 |
申请号 |
JP20090112212 |
申请日期 |
2009.05.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
REMIZOV SERGEY;JOUNG JAE-WOO;JUNG HYUN-CHUL;SONG YOUNG-AH |
分类号 |
H05K3/10;H05K3/12;H05K3/20 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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