METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SUBSTRATE SHEET WITH CONDUCTIVE BUMP

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board and a method for manufacturing a substrate sheet with conductive bumps capable of obtaining a multilayer printed wiring board in which a resistance value between substrate sheets with conductive bumps connected via conductive bumps breaking through a nonconductive sheet and sandwiching the nonconductive sheet is small.

SOLUTION: A planar substrate sheet 10 is sandwiched between a first planar member 20 having a plurality of protrusions 21 formed on the surface and a second planar member 22 having a plurality of concave portions 23 formed on the surface. A combined body of the first planar member 20, the substrate sheet 10 and the second planar member 22 is compressed. As described above, concave portions 12 are formed in advance in portions where the conductive bumps 14 are formed on the substrate sheet 10. The conductive bumps 14 are formed in the concave portions 12 of the substrate sheet 10 to manufacture the substrate sheet 10 with the conductive bumps 14.

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