发明名称 INJECTION MOLDING APPARATUS FOR THERMOSETTING RESIN
摘要 PROBLEM TO BE SOLVED: To provide an injection molding apparatus for thermosetting resin capable of preventing thermosetting liquid molding material from being cured in accordance with overheating of a nozzle and, at the same time, and preventing the thermosetting liquid molding material from leaking out of an aperture between the nozzle and a mold. SOLUTION: A sealing member 44, which comes to contact with a spool bush 22 when the thermosetting liquid molding material 8 is injected, is fitted to the distal end of a nozzle body 41. The sealing member 44 has thermal insulation performance, suppresses a temperature rise of the nozzle body 41, is interposed between the nozzle body 41 and the spool bush 22, and prevents the thermosetting liquid molding material 8 from leaking out of the aperture between both of them. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010064317(A) 申请公布日期 2010.03.25
申请号 JP20080231507 申请日期 2008.09.09
申请人 KOMATSULITE MFG CO LTD 发明人 MURAOKA YUJI;KITAGAWA TOSHIYA;YAMADA YOSHIYA;TAKAGAKI ATSUKO
分类号 B29C45/20;B29K101/10 主分类号 B29C45/20
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