发明名称 ON-DIE ANTI-RESONANCE STRUCTURE FOR INTEGRATED CIRCUIT
摘要 A structure and method for reducing the effects of chip-package resonance in an integrated circuit assembly is described. A series RLC circuit is employed to reduce the output impedance of the power delivery system at the resonance frequency.
申请公布号 US2010073972(A1) 申请公布日期 2010.03.25
申请号 US20090625090 申请日期 2009.11.24
申请人 CHEN HOUFEI 发明人 CHEN HOUFEI
分类号 H02M1/14 主分类号 H02M1/14
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