| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the phenomenon in which a die bonding resin creeps up a cavity along a valley part of the cavity provided on a conductor element. <P>SOLUTION: A semiconductor element 53 is provided with a diaphragm 72 on an upper surface of a base 71, through which a prismoid shaped cavity 73 vertically passes. A die bonding pad 65 is provided on an upper surface of a substrate 52 such as a printed wiring board, and a lower surface of the semiconductor element 53 is bonded on the die bonding pad 65 by a die bonding resin 74. The die bonding pad 65 formes an opening 76, by eliminating a region opposite to a lower end of the valley 75 formed on an inner peripheral face of the cavity 73 of the semiconductor element 53, and the die bonding pad 65 is formed so as not to be brought into contact with the lower end of the valley 75. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
