METHOD OF CAPPING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of capping a circuit board which closely connects a resin body surface and a PTH copper layer and does not make a lifting phenomenon occur after a reheat stress test.

SOLUTION: In the capping method, an electroplated through-hole PTH including a resin body after lamination treatment in a circuit board on which a first copper layer is electroplated is treated using a physical method. A micropore of a shallow blind via type is formed on a resin body surface of the PTH after lamination treatment. The step of copper plating in a second copper layer 13 is executed on the circuit board on which the first copper layer 11 is electroplated in the periphery of the PTH and the resin body surface including the micropore. A second copper layer is formed on the resin body surface and the first copper layer at the PTH periphery by a copper plating step. A downward protruded portion of the second copper layer is closely connected with the micropore of the resin body surface. The adhesion force of the resin body surface and the second copper layer plated on the PTH is increased by closely adhering the second copper layer to the resin body surface and the first copper layer.

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