发明名称 PRINTED WIRING STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed wiring structure which has a simple configuration and which comprises regions having the smaller number of conductor layers and regions having the larger number of conductor layers. <P>SOLUTION: The printed wiring structure uses a flexible printed wiring board having a conductor layer 120 and includes an overlap portion wherein a part of the flexible printed wiring board is folded, and a non-overlap portion wherein the flexible printed wiring board is not folded. The overlap portion includes a multilayer region wherein conductor layers (junction surfaces 12C and 14C) of the folded flexible printed wiring board are joined. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010067848(A) 申请公布日期 2010.03.25
申请号 JP20080233707 申请日期 2008.09.11
申请人 SUMITOMO ELECTRIC IND LTD 发明人 NAKATSUGI KYOICHIRO;TOSHIOKA HIDEAKI
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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