| 摘要 |
PROBLEM TO BE SOLVED: To decrease number of processes of applying the conductive paste to a surface of a substrate sheet, and eventually, shorten the manufacturing time of a substrate with a conductive bump, and at the same time, enhance the yield rate in the manufacture of the substrate sheet with the conductive bump. SOLUTION: A method for manufacturing the substrate sheet with the conductive bump includes: a contact process of bringing a plurality of plate convex parts 62a of a plate member 62 into contact with a substrate sheet 61; and a substrate convex part formation process of forming a substrate convex part 61a on the substrate sheet 61 corresponding to the plate convex part 62a of the plate member 62 by applying the pressure to the substrate sheet 61. Furthermore, the method for manufacturing the substrate sheet with the conductive bump also includes a transfer process of transferring a conductive paste 70 laid in a screen plate 27 onto the substrate convex part 61a of the substrate sheet 61 through a through-hole 27a provided in the screen plate 27 by scanning a squeegee 22 on the screen plate 27. COPYRIGHT: (C)2010,JPO&INPIT |
