| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor capable of reducing cost, and having high reliability in relation to connection of a negative electrode without causing deterioration of a lead frame terminal even by a reflow process. SOLUTION: The chip type solid electrolytic capacitor includes a solid electrolytic capacitive element 1 comprising: a positive electrode body with a positive electrode lead 20 led out therefrom; an oxide film on a surface thereof; a solid electrolyte layer formed on top of it; and a negative electrode extraction layer located on top of it and comprising a graphite layer and a silver paste layer. In the chip type solid electrolytic capacitor, a plate-like lead frame terminal 34 is connected to the negative electrode extraction layer by a conductive adhesive 3, base plated layers are formed on both surfaces of the lead frame terminal 34, a second plated layer 5 formed of a noble metal is formed only on a surface in contact with the conductive adhesive 3 on top of it, and, on other parts identical to that surface and almost over the whole of the back surface thereof, a tin-plated layer 6 is formed on the base plated layer so as not to contact the second plated layer 5 across a region 10 therefrom. COPYRIGHT: (C)2010,JPO&INPIT
|
