| 摘要 |
PROBLEM TO BE SOLVED: To provide a halogen-free resin composition which is prepared using a cyanide resin and is suitable as a material for a printed wiring board, wherein flame retardant, curability, heat resistance and heat resistance in moisture absorption are improved, and a novel prepreg and laminate using the same and an organic fiber substrate. SOLUTION: The resin composition essentially comprises a specific cyanide resin, a non-halogen epoxy resin and 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. The resin composition contains 10-89.7 pts.wt. of the cyanate resin, 10-89.7 pts.wt. of the non-halogen epoxy resin and 0.3-35 pts.wt. of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide based on 100 pts.wt. of the total amount of the cyanate resin, the non-halogen epoxy resin and 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. COPYRIGHT: (C)2010,JPO&INPIT
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