发明名称 SPUTTERING TARGET FOR FORMING WIRING FILM FOR FLAT PANEL DISPLAY
摘要 <P>PROBLEM TO BE SOLVED: To provide a sputtering target capable of forming a wiring film for flat panel display having a uniform specific resistance over the whole surface, and to provide the wiring film for flat panel display formed by using the sputtering target. Ž<P>SOLUTION: The sputtering target for forming the wiring film for flat panel display has a composition which includes: Cr of 0.1 to 15 atom%; and one or a sum of two of Li and Ca of 0.1 to 15 atom% such that a sum of Cr, Li and Ca lies in the range of 0.2 to 20 atom% and, further as necessary, includes Mg of 0.1 to 5 atom%, wherein the remaining part consists of Cu and inevitable impurities. The wiring film for flat panel display and a wiring substrate film for flat panel display are formed by using the sputtering target. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010065284(A) 申请公布日期 2010.03.25
申请号 JP20080233101 申请日期 2008.09.11
申请人 MITSUBISHI MATERIALS CORP 发明人 MAKI KAZUMASA;TANIGUCHI KENICHI;NAKAZATO YOSUKE
分类号 C23C14/34;C23C14/14;H01L21/285 主分类号 C23C14/34
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