| 摘要 |
<p>Provided are a motherboard wherein a waste board region is reduced, while efficiently arranging panel boards on the motherboard, a method for manufacturing such motherboard, and a device board composed of the panel board formed on the motherboard. The motherboard is provided with a plurality of panel boards and a silicon thin film which is formed on the main surface. Each of the panel boards is provided with a transistor forming region and an end region. The transistor forming region is formed by polycrystallizing the silicon thin film, the end region is arranged on an outer end of each panel board, and at least one panel board has, in the end region, a region including a silicon thin film having a crystal profile different from that of the silicon thin film in the transistor forming region.</p> |
