发明名称 METHOD OF ETCHING THE CARBON LAYER AND METHOD OF FORMING THE CONTACT HOLE
摘要 PURPOSE: A method for etching a carbon layer and the method for forming a contact hole using the same are provided to prevent the deterioration of a threshold line width of openings using an etch gas with a xenon gas and an oxygen gas. CONSTITUTION: A capping film pattern is formed on a carbon layer(S120). The carbon layer is plasma-etched using an etch gas(S130). The etch gas includes oxygen and xenon. The carbon layer is exposed by the capping film pattern. The etch gas includes a xenon gas or mixture of the xenon and argon with the oxygen gas.
申请公布号 KR20100031962(A) 申请公布日期 2010.03.25
申请号 KR20080090874 申请日期 2008.09.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, NAM GUN;CHO, SUNG IL;HAN, YEONG HUN
分类号 H01L21/3065 主分类号 H01L21/3065
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