| 摘要 |
PROBLEM TO BE SOLVED: To improve an adhesion strength of a pad by suppressing the occurrence of cracks to improve reliability as a product, and to improve connection reliability to a motherboard, etc. SOLUTION: A wiring board includes a pad 11P exposed from an opening of an insulating layer 12 of the outermost layer. The pad 11P includes: a first metal layer 21 whose surface is exposed from the wiring board; a second metal layer 22 provided on the metal layer; and a third metal layer 23 which is provided between the second metal layer and a via 13 inside the board. A flat surface form of the second metal layer 22 is formed smaller than that of the pad 11P. The periphery of the second metal layer 22 is retreated to the inner side from the periphery of the pad 11P by an equal amount to the thickness thereof. COPYRIGHT: (C)2010,JPO&INPIT |
