| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power supply unit which can be reduced in thickness, without causing deterioration of heat radiation efficiency. <P>SOLUTION: The power supply unit includes a heat radiating plate 21 disposed on a circuit board 10 so that the main surface can oppose a component surface of the circuit board 10; a circuit element 22 attached on the main surface of the circuit board side of the heat radiation plate 21 with a space intervened between the circuit element and the circuit board 10; and a circuit element 25 attached on the side opposite to the circuit board of the heat radiation plate 21. The heat radiating plate 21 has an upper surface element disposing region 24 bent toward the circuit board side and positioned more closely to the circuit board side than the region where the circuit element 22 is disposed. The circuit element 25 is attached in the upper surface element disposing region 24. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
