| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent deterioration of reliability caused by exposure of conductors and jump of solder balls due to dripping of paste for insulation coat when solder is melted and solidified in electrodes provided on the surface of a multilayer substrate. <P>SOLUTION: Bores are provided on a first green sheet layer 4 which is an uppermost layer of a multilayer ceramic substrate; hollows 7 are formed with steps when the first green sheet layer 4 is laminated on a second green sheet layer 5; and internal layer conductors 6 are formed as electrodes on the entire bottom surfaces of the hollows 7. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
