发明名称 Thin-Film Light Emitting Diode Chip and Method for Producing a Thin-Film Light Emitting Diode Chip
摘要 A thin-film light-emitting diode chip with a layer stack having a first emission surface and an opposite second emission surface, so that the thin-film light-emitting diode chip has at least two main emission directions. Measures for improving the outcoupling of the light generated in the layer sequence are provided on both the first and the second main emission surface. A method is disclosed for manufacturing a thin-film light-emitting diode chip.
申请公布号 US2010072500(A1) 申请公布日期 2010.03.25
申请号 US20070525066 申请日期 2007.01.22
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 HERRMANN SIEGFRIED
分类号 H01L33/00;H01L33/20;H01L33/22 主分类号 H01L33/00
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