| 摘要 |
<p>A semiconductor package is provided to change bias point and timing property of an inner voltage by transmitting temperature information of a DRAM to a flash chip. A semiconductor package comprises a first chip and a second chip. The first chip detects temperature information about specific temperature and output the temperature information at regular intervals. The second chip changes inner processes in corresponding to the temperature information applied by the first chip. The first chip is a DRAM. The second chip is a flash chip.</p> |
