| 摘要 |
PROBLEM TO BE SOLVED: To provide a fluorine resin printed circuit board which can attain a high dielectric constant of 10 or higher, have an excellent board thickness accuracy and through-hole reliability, and avoid board swelling upon molding the substrate. SOLUTION: In a fluorine resin printed circuit board 1 having a dielectric constant of 10 or higher, a metallic foil 3 formed with a predetermined conductor pattern is provided on at least one surface side of a prepreg laminate 2. The prepreg laminate 2 has a first prepreg 4 obtained by immerging an aqueous dispersion containing a surfactant including, as its main components, a fluorine resin 7, an inorganic filler 8 having a dielectric constant of 100 or higher and a polyoxyethylene polycyclic phenyl ether into a glass cloth 6 of H glass and then drying the cloth. COPYRIGHT: (C)2007,JPO&INPIT |
