发明名称 A METHOD FOR FORMING A PATTERNED LAYER ON A SUBSTRATE
摘要 <p>This invention relates to a method for forming a patterned layer on a substrate by means of an imprint process. According to the method a first layer is provided on the substrate, and a pattern of recesses is provided in the first layer by imprinting the layer with a patterning means. Then the first layer is cured. The curing is followed by performing a first surface treatment onto the first layer to make the surface of thereof hydrophilic, and then performing a second surface treatment onto a selected subarea of the surface of the first layer to make the. subarea hydrophobic. The subarea includes surface portions between the recesses and excludes the recesses. Finally, a conducting pattern material (41) is deposited into the recesses.</p>
申请公布号 EP2165366(A2) 申请公布日期 2010.03.24
申请号 EP20080789172 申请日期 2008.06.30
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 VERSCHUUREN, MARCUS, A.;LIFKA, HERBERT;TANASE, CRISTINA
分类号 H01L27/32;H01L51/52 主分类号 H01L27/32
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