| 摘要 |
<p>On the upper surface of a substrate (52) (printed board), a die bonding section (55) and a wire bonding terminal (56) are formed by a conductive pattern. On the upper surface of the die bonding section (55), a semiconductor element (53) is adhered and fixed by using a die bonding resin (68). A terminal of the semiconductor element (53) and the wire bonding terminal (56) are connected by a bonding wire (69). Furthermore, a groove section (64) is formed at the periphery of the wire bonding terminal (56) to surround the wire bonding terminal (56) so as to capture the die bonding resin (68) and prevent the die bonding resin from flowing to the side of the wire bonding terminal (56).</p> |
