发明名称 |
Non-invasive electrical measurement of semiconductor wafers |
摘要 |
<p>A multi-probe assembly includes a chuck assembly configured to receive a back or front surface of a semiconductor wafer. A multi-probe holder has a plurality of probes each having an elastically deformable conductive tip movable into contact with a front surface of a dielectric or a front surface of a semiconducting material. A means applies an electrical stimulus to each tip, measures a response to the electrical stimulus, and determines at least one electrical property of the dielectric and/or the semiconducting material. A method for measuring at least one electrical property applies a probe (or plurality of probes) having an elastically deformable conductive tip to a scribe line(s). An electrical stimulus is applied to the probe or one of the probes with the remaining probes grounded. A response to the electrical stimulus is measured and at least one electrical property of the semiconductor wafer is determined from the response.</p> |
申请公布号 |
EP1353366(A3) |
申请公布日期 |
2010.03.24 |
申请号 |
EP20030076093 |
申请日期 |
2003.04.11 |
申请人 |
SOLID STATE MEASUREMENTS, INC. |
发明人 |
HOWLAND, WILLIAM H. |
分类号 |
G01R1/06;H01L21/66;G01R31/28;G01R31/312 |
主分类号 |
G01R1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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