发明名称 |
Microfabrication using patterned topography and self-assembled monolayers |
摘要 |
A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Articles formed from this method are also disclosed.
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申请公布号 |
US7682703(B2) |
申请公布日期 |
2010.03.23 |
申请号 |
US20060564582 |
申请日期 |
2006.11.29 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
FREY MATTHEW H.;NGUYEN KHANH P. |
分类号 |
B32B27/00;B29D7/00 |
主分类号 |
B32B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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