| 摘要 |
A semiconductor package and a manufacturing method thereof are provided to prevent a seed layer from being separated from a semiconductor die by forming more extensive seed layer than an UBM(Under Bump Metal). A plurality of bond pads are formed in a semiconductor die. A RDL(ReDistribution Layer)(140) is formed in an upper part of the semiconductor die. The one end of the RDL is electrically connected to the bond pad. An insulating layer(150) is formed in the upper part of the RDL and is patterned to expose the other end of the RDL. A UBM seed layer(160) is formed in the upper part of the insulating layer and is electrically connected to the other end of the exposed RDL. An UBM(170) is formed in the upper part of the UBM seed layer. The UBM seed layer is extensively formed to the horizontal direction of the semiconductor die than the UBM. |
