发明名称 Mask data correction method, photomask manufacturing method, computer program, optical image prediction method, resist pattern shape prediction method, and semiconductor device manufacturing method
摘要 According to an aspect of the invention, there is provided a mask data correction method used when forming a photomask used in a photolithography process, comprising correcting mask data on the basis of simulation performed by using information including nonuniformity of an illumination luminance distribution in an exposure apparatus which uses the photomask formed by using the mask data obtained by the correction result.
申请公布号 US7685556(B2) 申请公布日期 2010.03.23
申请号 US20050062437 申请日期 2005.02.23
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 FUKUHARA KAZUYA;KAWAMURA DAISUKE;MIMOTOGI SHOJI
分类号 G03F1/08;G06F17/50;G03F1/14;G03F1/32;G03F1/36;G03F1/68;G03F1/70;G03F1/72;G03F7/00;G03F7/20;H01L21/00;H01L21/027 主分类号 G03F1/08
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