发明名称 |
Intermetallic diffusion block device and method of manufacture |
摘要 |
One embodiment of the present invention is directed to an under bump metallurgy material. The under bump metallurgy material of this embodiment includes an adhesion layer and a conduction layer formed on top of the adhesion layer. The under bump metallurgy material of this embodiment also includes a barrier layer plated on top of the conduction layer and a sacrificial layer plated on top of the barrier layer. The conduction layer of this embodiment includes a trench formed therein, the trench contacting a portion of the barrier layer and blocking a path of intermetallic formation between the conduction layer and the sacrificial layer.
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申请公布号 |
US7683493(B2) |
申请公布日期 |
2010.03.23 |
申请号 |
US20080111510 |
申请日期 |
2008.04.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ARVIN CHARLES L.;BAILEY CARLA A.;COX HARRY D.;GAN HUA;LIU HSICHANG;MERRYMAN ARTHUR G.;MCCLEAN VALL F.;REDDY SRINIVASA S. N.;SUNDLOF BRIAN R. |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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