| 发明名称 |
Package-on-package system with heat spreader |
| 摘要 |
A package-on-package system includes: providing a base substrate; mounting an integrated circuit on the base substrate; positioning a stacking interposer over the integrated circuit; and forming a heat spreader base around the integrated circuit by coupling the base substrate and the stacking interposer to the heat spreader base.
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| 申请公布号 |
US7683469(B2) |
申请公布日期 |
2010.03.23 |
| 申请号 |
US20080131038 |
申请日期 |
2008.05.30 |
| 申请人 |
STATS CHIPPAC LTD. |
发明人 |
OH JIHOON;LEE KYUWON;LIM JAEHYUN;PARK JONGVIN;LEE SINJAE |
| 分类号 |
H01L23/02;H01L23/10;H01L23/34;H01L23/48;H01L23/495;H01L23/52;H01L29/40 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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