发明名称 |
Test structure for electromigration analysis and related method |
摘要 |
A test structure for electromigration and related method are disclosed. The test structure may include an array of a plurality of multilink test sets, each multilink test set including a plurality of metal lines positioned within a dielectric material and connected in a serial configuration; each multilink test set being connected in a parallel configuration with the other multilink test sets, the parallel configuration including a first electrical connection to a cathode end of a first metal line in each multilink test set and a second electrical connection to an anode end of a last metal line in each multilink test set.
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申请公布号 |
US7683651(B2) |
申请公布日期 |
2010.03.23 |
申请号 |
US20090348434 |
申请日期 |
2009.01.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHANDA KAUSHIK;FILIPPI RONALD G.;WANG PING-CHUAN |
分类号 |
G01R31/26;G01R19/00;H01L23/58 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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