发明名称 |
Solder paste and printed circuit board |
摘要 |
In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
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申请公布号 |
US7681777(B2) |
申请公布日期 |
2010.03.23 |
申请号 |
US20060547539 |
申请日期 |
2006.07.28 |
申请人 |
SENJU METAL INDUSTRY CO., LTD.;PANASONIC CORPORATION |
发明人 |
HIRATA MASAHIKO;TAGUCHI TOSHIHIKO;OKUYAMA MASANOBU;TOYODA YOSHITAKA |
分类号 |
B23K35/14;B23K35/02;B23K35/26;H05K3/34 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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