| 摘要 |
PURPOSE: A wafer prober including a dual chuck is provided to improve the wafer test peed of the wafer prober by alternately performing one operation of the dual chuck plate which loads, aligns ad unloads wafer and the other operation of the dual chuck plate which contacts wafer to a probe card. CONSTITUTION: A first and a second chuck plate transfer parts transfer a first and a second chuck plate. A camera part takes a photograph of a wafer. A wafer transfer loads, unloads and aligns a wafer to the first and second chuck plates. A dual chuck plate transfer part(230, 232) alternately transfers the first and second chuck plates to a camera part and a probe card installing part. A control part(200) changes the first and second chuck plates.
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