PROBE CARD AND METHOD FOR WAFER TEST USING THE SAME

摘要

PURPOSE: A probe card and a method for testing a wafer using the same are provided to minimize the number of a test by forming the probe card of which size is corresponded to the wafer in order to minimize the thermal deformation. CONSTITUTION: A circuit board(310) and a probe head body(320), units for a probe module(330) and a sub board(340) are prepared. The circuit board and the probe head body are successively stacked. The units for the probe module are arranged on the probe head body with spaced gaps. The sub board is arranged adjacent to the units for the probe module and connected to the units for the probe module.